Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics

Innovation in materials and technologies has promoted the fabrication of thin-film electronics on substrates previously considered incompatible because their chemical or mechanical properties. Indeed, conventional processes, typically based photolithography, involve solvents acids that might harm fragile exotic substrates. In this context, transfer techniques define a route to overcome issues related nature substrate by using supportive carriers stack mitigate avoid any damages during process. Here, substrate-free approach is presented for ultra-thin (<150nm-thick) where no additional layer besides one remains final substrate. Devices are transferred several surfaces showing good adhesion an average performance variation 27%. Furthermore, sensor bent radius 15.25µm, shows 5%. The technique can also be sequentially repeated stacked electronics, enabling development devices, compliant unconventional surfaces.